Die Failure Pattern Detection in Semiconductor Wafers
Problem:
Analyzing the WBMs manually is an extremely time consuming process. It also leads to a high margin error when a subsample of WBMs are examined manually because the sample is not a good representation of the entire lot.
Benefits:
The identified defect patterns are used by experts to tie back to the process variables for root cause analysis, saving a lot of money and time by early prevention in the manufacturing process.